Industry Outreach at Texas Instruments sponsored by the RS Dallas Chapter

W. Eric Wong

Vice President, Technical Activities

&

Chair, Dallas Chapter


After a series of successful student outreach events at the University of Texas at Dallas focusing on college students, the RS Dallas Chapter took further steps to organize an industry outreach on April 19 at Texas Instruments by presenting a special luncheon lecture for engineers at this world renowned semi-conductor manufacturer. The talk focused on "ESD Design Challenges in Stateof- the-Art Analog Technologies" which have rapidly multiplied in recent years due to the phenomenal success of portable consumer electronics such as smartphones, tablets, and navigation devices. As a result, various analog functions need to be integrated into these devices. From an ESD standpoint, the large components portfolio typical of state-of-the-art analog technologies poses significant development obstacles. To this end, the speaker Dr. Gianluca Boselli carefully outlined these challenges and addressed possible solutions.

The seminar attracted more than 30 engineers from TI (see the following Figure) and generated many follow-up discussions with an overwhelming positive response.

The success of this outreach was ensured by the authority of Dr. Boselli on the subject, who has published many papers in the area of ESD and Latch-up. He was also the winner of Best Paper Awards from both the Microelectronics Reliability Journal in 2000 as well as the EOS/ESD Symposium 2002. In addition, Dr. Boselli received the Outstanding Symposium Award at EOS/ESD 2002, 2006 and 2010. Currently, he is on the Editorial Board of the IEEE Transactions on Device and Materials Reliability (T-DMR).

Special acknowledgment also goes to Paul Tiner (EP Reliability Manager at Texas Instruments) and Ron Kenner (Membership Chair of the Dallas Chapter) for their effort to make this industry outreach a great success.