IRPS addresses state-of-the-art developments in the Reliability Physics of devices, materials, circuits, and products used in electronics industry. IRPS is the venue where important reliability challenges and solutions are first discussed.

IRPS15 is soliciting increased participation in the following areas: Impact of Transistor aging on IC Reliability, Reliability of Ge & III-V devices for CMOS applications, Packaging.

Devices, Processes and Materials Reliability: Transistors, technologies beyond CMOS, compound/opto Electronics, Dielectrics Breakdown, Interconnects, Process Integration, Failure Analysis, Memory, Packaging.

Circuits and Products: Circuits Reliability, Circuits Aging Simulation, Product IC Reliability, Consumer Electronics Reliability, Electronic Systems Reliability, ESD and Latchup, Soft Errors, TSV/3D.

Abstract (Paper/Poster) Submission due October 13th, 2014: Your two pages original abstract submission should clearly and concisely state specific results, why they are important, and how they relate to prior work using IRPS document template available at www.irps.org. Notification of acceptance by December 18th, 2014. Following abstract review and paper acceptance, full manuscripts of accepted papers will be due before the conference. Registration to the conference is required for the author presenting the paper.

Late Paper Submission: Space permitting, full-length manuscripts with late breaking news may be considered for inclusion in the conference/proceedings. Due January 12, 2015.

For detailed information for the 2015 IRPS submission, click here for the 2015 IRPS Call for Papers.

Co-sponsored by:

General Chair:
Giuseppe LaRosa
IBM
larosa@us.ibm.com

Technical Program Chair:
Yuan Chen
NASA
yuan.chen@nasa.gov

Vice TPC/Publicity:
Chris Connor
Intel
chris.connor@intel.com

Call for Papers 2015 IEEE International Reliability Physics Symposium (IRPS15) www.irps.org

Call for Papers
2015 IEEE International Reliability Physics Symposium (IRPS15)
www.irps.org